Invention Grant
- Patent Title: Conductive paste, printed circuit board, and manufacturing method thereof
- Patent Title (中): 导电浆料，印刷电路板及其制造方法
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Application No.: US12076117Application Date: 2008-03-13
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Publication No.: US08298447B2Publication Date: 2012-10-30
- Inventor: Ki-Hwan Kim , Jee-Soo Mok , Myung-Sam Kang
- Applicant: Ki-Hwan Kim , Jee-Soo Mok , Myung-Sam Kang
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0061835 20070622
- Main IPC: H01B1/02
- IPC: H01B1/02 ; H01B1/22 ; B32B37/00 ; B29C44/34 ; C08J9/22
Abstract:
A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.
Public/Granted literature
- US20080314619A1 Conductive paste, printed circuit board, and manufacturing method thereof Public/Granted day:2008-12-25
Information query
