A method of soldering terminals of a micro-speaker on a circuit board comprises the following steps. Firstly, providing a circuit board having a pair of through holes passing therethrough, and two soldering sections defined surrounding the pair of through holes. Secondly, the soldering sections are plated with soldering tin. Thirdly, providing a pair of columned terminals, the terminal includes an upper portion, a low portion and a body connecting between the upper portion and the low portion. Fourthly, the low portion of the terminal is inserted into the corresponding through hole and the body is resisted on the soldering section. Fifthly, the soldering tin is heated to solder the body on the soldering tin. Finally, the upper portion of the terminal is soldered onto the corresponding end of the voice coil. As a result, soldering defective can be reduced.