公开(公告)号：US08300876B2

公开(公告)日：2012-10-30

申请号：US12978594

申请日：2010-12-26

Applicant: Tong-Ming Xu

Inventor： Tong-Ming Xu

IPC: H04R1/00 ,  H04R25/00

CPC classification number: H04R1/06 ,  H04R31/006 ,  H04R2400/00 ,  Y10T29/49005

Abstract: A method of soldering terminals of a micro-speaker on a circuit board comprises the following steps. Firstly, providing a circuit board having a pair of through holes passing therethrough, and two soldering sections defined surrounding the pair of through holes. Secondly, the soldering sections are plated with soldering tin. Thirdly, providing a pair of columned terminals, the terminal includes an upper portion, a low portion and a body connecting between the upper portion and the low portion. Fourthly, the low portion of the terminal is inserted into the corresponding through hole and the body is resisted on the soldering section. Fifthly, the soldering tin is heated to solder the body on the soldering tin. Finally, the upper portion of the terminal is soldered onto the corresponding end of the voice coil. As a result, soldering defective can be reduced.

Abstract translation: 在电路板上焊接微型扬声器的端子的方法包括以下步骤。 首先，提供具有穿过其中的一对通孔的电路板和围绕该对通孔限定的两个焊接部分。 其次，焊接部分镀锡锡。 第三，提供一对柱状端子，该端子包括上部，下部和连接在上部和下部之间的主体。 第四，将端子的低部分插入对应的通孔中，并且在焊接部分上抵抗主体。 第五，焊锡被加热以焊接锡焊锡上的主体。 最后，将终端的上部焊接到音圈的相应端。 结果，可以减少焊接不良。