Invention Grant
US08304015B2 Resin film forming method, resin film forming apparatus, and electronic circuit board manufacturing method
有权
树脂膜形成方法，树脂膜形成装置和电子电路板的制造方法
- Patent Title: Resin film forming method, resin film forming apparatus, and electronic circuit board manufacturing method
- Patent Title (中): 树脂膜形成方法，树脂膜形成装置和电子电路板的制造方法
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Application No.: US12057079Application Date: 2008-03-27
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Publication No.: US08304015B2Publication Date: 2012-11-06
- Inventor: Junichi Yoshida , Seiichi Inoue , Jun Yamanobe , Manabu Katsumura
- Applicant: Junichi Yoshida , Seiichi Inoue , Jun Yamanobe , Manabu Katsumura
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-095512 20070330
- Main IPC: B28B19/00
- IPC: B28B19/00 ; B29B15/10 ; C23C18/00 ; C23C20/00 ; C23C24/00 ; C23C26/00 ; C23C28/00 ; C23C30/00 ; H01C17/06 ; H05K3/00
Abstract:
A method forms a resin film on a substrate by depositing droplets of resin liquid by an inkjet method. The method includes: a first resin liquid arrangement step of arranging a plurality of droplets of a first resin liquid separately from each other on a substrate in such a manner that the droplets do not make contact with each other; a first resin liquid curing step of curing at least a surface of each of the droplets of the first resin liquid arranged on the substrate; a second resin liquid arrangement step of arranging a plurality of droplets of a second resin liquid at substantially central positions between the droplets of the first resin liquid on the substrate, after the at least the surface of each of the droplets of the first resin liquid is cured; and a second resin liquid curing step of curing the droplets of the second resin liquid arranged on the substrate.
Public/Granted literature
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