发明授权
US08304813B2 Connection between an I/O region and the core region of an integrated circuit
有权
I / O区域与集成电路的核心区域之间的连接
- 专利标题： Connection between an I/O region and the core region of an integrated circuit
- 专利标题（中）： I / O区域与集成电路的核心区域之间的连接
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申请号： US11651614申请日： 2007-01-08
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公开(公告)号： US08304813B2公开(公告)日： 2012-11-06
- 发明人: Paul Lassa , Paul Paternoster , Brian Cheung
- 申请人： Paul Lassa , Paul Paternoster , Brian Cheung
- 申请人地址： US TX Plano
- 专利权人： SanDisk Technologies, Inc.
- 当前专利权人： SanDisk Technologies, Inc.
- 当前专利权人地址： US TX Plano
- 代理机构： Brinks Hofer Gilson & Lione
- 主分类号： H01L27/118
- IPC分类号： H01L27/118
摘要：
A connection between a first circuit within an I/O region of an integrated circuit chip and a second circuit within a core region of the chip. The first circuit is connected to a bonding pad through a first conductor in a first layer of an I/O region. The second circuit is connected to the bonding pad through a second conductor in a second layer of an I/O region above the first layer.