Invention Grant
US08304874B2 Stackable integrated circuit package system 有权
可堆叠集成电路封装系统

Stackable integrated circuit package system
Abstract:
A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.
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