Invention Grant
- Patent Title: Stackable integrated circuit package system
- Patent Title (中): 可堆叠集成电路封装系统
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Application No.: US11608826Application Date: 2006-12-09
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Publication No.: US08304874B2Publication Date: 2012-11-06
- Inventor: Hun Teak Lee , Tae Keun Lee , Soo Jung Park
- Applicant: Hun Teak Lee , Tae Keun Lee , Soo Jung Park
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Agent Mikio Ishimaru; Stanley M. Chang
- Main IPC: H01L23/538
- IPC: H01L23/538

Abstract:
A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.
Public/Granted literature
- US20080136005A1 STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM Public/Granted day:2008-06-12
Information query
IPC分类: