Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12824865Application Date: 2010-06-28
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Publication No.: US08305156B2Publication Date: 2012-11-06
- Inventor: Yu-Chang Pai , Po-Chuan Hsieh , Chien-Hung Liu
- Applicant: Yu-Chang Pai , Po-Chuan Hsieh , Chien-Hung Liu
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99119772A 20100617
- Main IPC: H04B3/28
- IPC: H04B3/28

Abstract:
A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollow spiral patterns in the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines onto the ground layer. Hollowed areas of the two filter portions are bridged by a void.
Public/Granted literature
- US20110309898A1 PRINTED CIRCUIT BOARD Public/Granted day:2011-12-22
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