公开(公告)号：US08350150B2

公开(公告)日：2013-01-08

申请号：US12860941

申请日：2010-08-23

申请人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai

发明人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai

IPC分类号： H05K5/00

CPC分类号： H05K9/0041 ,  B21D28/10 ,  Y10T29/49 ,  Y10T29/49826

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 每个通孔具有彼此连接并与通孔连接的一对突片。 每对翼片朝向机壳的内侧倾斜弯曲。 带屏蔽的外壳可以屏蔽电子设备免受电磁干扰。

公开(公告)号：US08253509B2

公开(公告)日：2012-08-28

申请号：US12823147

申请日：2010-06-25

申请人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh

发明人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh

IPC分类号： H04B3/28

CPC分类号： H05K1/0224 ,  H01P1/20381 ,  H01P3/026 ,  H05K1/0245 ,  H05K1/165

摘要： A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines.

摘要翻译： 印刷电路板包括与信号层相邻的信号层和接地层。 信号层包括一对差动传输线。 接地层包括第一空隙，第二空隙，第三空隙和共模滤波器。 第一空隙和第二空隙分别布置在接地层上的一对差动传输线的突起的相对侧，并与第三空隙桥接。 共模过滤器包括位于第一空隙中的第一过滤器部分和位于第二空隙中的第二过滤器部分。 第一和第二滤波器部分中的每一个包括沿着平行于一对差动传输线的突起的方向并排布置的多个线圈。

公开(公告)号：US08275923B2

公开(公告)日：2012-09-25

申请号：US12880155

申请日：2010-09-13

申请人： Po-Chuan Hsieh ,  Chien-Hung Liu ,  Yu-Chang Pai

发明人： Po-Chuan Hsieh ,  Chien-Hung Liu ,  Yu-Chang Pai

IPC分类号： G06F13/00

CPC分类号： G06F13/409 ,  G06F3/061 ,  G06F3/0626 ,  G06F3/0658 ,  G06F3/0683

摘要： An exemplary high speed data storage system includes hard disks, a first control panel, a second control panel and a midplane interconnected between each of the first and second control panels and the hard disks. Each of the first and second control panels includes a control chip and a connector. First and second printed circuit wires corresponding to the hard disks are layered on the first and second control panels for electrically connecting the control chip with the connector, respectively. The first printed circuit wires of the first control panel and the second printed circuit wires of the second control panel are arranged symmetrically with respect to each other, and an order of stacking circuit layers of the first printed circuit wires of the first control panel is the reverse of an order of stacking of circuit layers of the second printed circuit wires of the second control panel.

摘要翻译： 示例性的高速数据存储系统包括硬盘，第一控制面板，第二控制面板和互连在第一和第二控制面板和硬盘中的每一个之间的中间面板。 第一和第二控制面板中的每一个包括控制芯片和连接器。 分别对应于硬盘的第一和第二印刷电路线分别在第一和第二控制面板上分别用于将控制芯片与连接器电连接。 第一控制面板的第一印刷电路布线和第二控制面板的第二印刷电路布线相对于彼此对称布置，第一控制面板的第一印刷电路布线的层叠电路层的顺序为 第二控制面板的第二印刷电路线的电路层的层叠顺序相反。

公开(公告)号：US08068553B2

公开(公告)日：2011-11-29

申请号：US12633895

申请日：2009-12-09

申请人： Po-Chuan Hsieh ,  Chun-Jen Chen ,  Chien-Hung Liu ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Chun-Jen Chen ,  Chien-Hung Liu ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H04L7/02 ,  H04B7/02

CPC分类号： H04B17/0085 ,  H04B17/21 ,  H04B17/23 ,  H04B17/327 ,  H04L1/0668

摘要： A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.

摘要翻译： 用于多输入多输出（MIMO）天线系统的性能评估系统从输入设备接收模拟参数，并相应地模拟MIMO天线系统。 还提供了一种方法，当通过MIMO天线系统传输一系列射频（RF）信号时，进一步评估模拟MIMO天线系统的性能，并且在用于评估的显示装置上显示MIMO天线系统的性能分析结果 的模拟MIMO天线系统的性能。

公开(公告)号：US08263877B2

公开(公告)日：2012-09-11

申请号：US12837487

申请日：2010-07-15

申请人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

发明人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai ,  Shou-Kuo Hsu

IPC分类号： H05K1/11

CPC分类号： H05K1/162 ,  H05K1/0239 ,  H05K2201/0397 ,  H05K2201/10015 ,  H05K2201/1034

摘要： A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.

摘要翻译： 印刷电路板包括第一信号层，第二信号层和夹在第一信号层和第二信号层之间的电介质层。 第一信号层包括两个焊盘。 第二信号层包括连接到两个信号迹线的两个导电片。 垫的形状和材料与导电片的形状和材料相同。 第二信号层上的焊盘的突起与导电片重叠。

公开(公告)号：US20110299263A1

公开(公告)日：2011-12-08

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。

公开(公告)号：US20110298341A1

公开(公告)日：2011-12-08

申请号：US12859283

申请日：2010-08-19

申请人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

发明人： Chien-Hung Liu ,  Yu-Chang Pai ,  Po-Chuan Hsieh ,  Shou-Kuo Hsu

IPC分类号： H05K5/02

CPC分类号： H05K9/0086

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes with a number of shields. Each shield includes a tab apart from the plate. At least two spaced connection pieces connect the tab to a corresponding through hole in such a way that the tab is substantially aligned with and spaced from the corresponding through hole.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个具有多个屏蔽的通孔。 每个护罩包括一个离开板的突出部分。 至少两个间隔开的连接件将突片连接到对应的通孔，使得突出部基本上与相应的通孔对准并与之隔开。

公开(公告)号：US08466376B2

公开(公告)日：2013-06-18

申请号：US12868687

申请日：2010-08-25

申请人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu

发明人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu

IPC分类号： H05K7/20

CPC分类号： H05K9/0041

摘要： An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.

摘要翻译： 电子设备的外壳包括通风板。 通风板是包括多个十字交叉的连接杆和由连接杆限定的多个通孔的格栅。 每个连接条形成在每个通孔上的突片。 突片从网格的平面基本成角度，以延长电磁信号必须行进以通过通风板的路径。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US08389873B2

公开(公告)日：2013-03-05

申请号：US12841125

申请日：2010-07-21

申请人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00 ,  H02B1/56

CPC分类号： H05K9/0041 ,  H05K9/0024

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 多个屏蔽件从对应于通孔的板延伸。 每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US08305774B2

公开(公告)日：2012-11-06

申请号：US12855903

申请日：2010-08-13

申请人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

发明人： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC分类号： H05K9/00

CPC分类号： H05K9/0041

摘要： An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

摘要翻译： 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。