发明授权
- 专利标题: Memory cell having nonmagnetic filament contact and methods of operating and fabricating the same
- 专利标题(中): 具有非磁性丝接触的存储单元及其操作和制造方法
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申请号: US13154254申请日: 2011-06-06
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公开(公告)号: US08309166B2公开(公告)日: 2012-11-13
- 发明人: Jun Liu , Gurtej Sandhu
- 申请人: Jun Liu , Gurtej Sandhu
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Fletcher Yoder
- 主分类号: G11C11/00
- IPC分类号: G11C11/00 ; G11C7/00
摘要:
A magnetic cell structure including a nonmagnetic filament contact, and methods of fabricating the structure are provided. The magnetic cell structure includes a free layer, a pinned layer, an insulative layer between the free and pinned layers, and a nonmagnetic filament contact in the insulative layer which electrically connects the free and pinned layers. The nonmagnetic filament contact is formed from a nonmagnetic source layer, also between the free and pinned layers. The filament contact directs a programming current through the magnetic cell structure such that the cross sectional area of the programming current in the free layer is less than the cross section of the structure. The decrease in the cross sectional area of the programming current in the free layer enables a lower programming current to reach a critical switching current density in the free layer and switch the magnetization of the free layer, programming the magnetic cell.
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