Structure for electrostatic discharge in embedded wafer level packages

Invention Grant

US08309454B2 Structure for electrostatic discharge in embedded wafer level packages 有权

Title translation: 嵌入式晶圆级封装中的静电放电结构

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Patent Title: Structure for electrostatic discharge in embedded wafer level packages
Patent Title (中): 嵌入式晶圆级封装中的静电放电结构
Application No.: US11746936

Application Date: 2007-05-10
Publication No.: US08309454B2

Publication Date: 2012-11-13
Inventor: Markus Brunnbauer , Thorsten Meyer , Stephan Bradl , Ralf Plieninger , Jens Pohl , Klaus Pressel , Recai Sezi
Applicant: Markus Brunnbauer , Thorsten Meyer , Stephan Bradl , Ralf Plieninger , Jens Pohl , Klaus Pressel , Recai Sezi
Applicant Address: DE Neubiberg
Assignee: Intel Mobile Communications GmbH
Current Assignee: Intel Mobile Communications GmbH
Current Assignee Address: DE Neubiberg
Agency: Edell, Shapiro & Finnan, LLC
Priority: DE102007020656 20070430
Main IPC: H01L21/4763
IPC: H01L21/4763

Structure for electrostatic discharge in embedded wafer level packages

Abstract:

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.

Abstract(Chinese):

工件具有至少两个半导体芯片，每个半导体芯片具有至少部分暴露的第一主表面和第二主表面。所述工件还包括布置在所述至少两个半导体芯片上的导电层，所述导电层至少布置在所述第二主表面的区域上，所述模制化合物布置在所述导电层上。

Public/Granted literature

US20080265421A1 Structure for Electrostatic Discharge in Embedded Wafer Level Packages Public/Granted day:2008-10-30

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763	......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）