Invention Grant
- Patent Title: Light emitting diode package and fabrication method thereof
- Patent Title (中): 发光二极管封装及其制造方法
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Application No.: US12360444Application Date: 2009-01-27
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Publication No.: US08310023B2Publication Date: 2012-11-13
- Inventor: Ho Joon Park , Woong Lin Hwang , Seog Moon Choi , Sung Jun Lee , Sang Hyun Choi , Chang Hyun Lim
- Applicant: Ho Joon Park , Woong Lin Hwang , Seog Moon Choi , Sung Jun Lee , Sang Hyun Choi , Chang Hyun Lim
- Applicant Address: KR Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2005-0015152 20050223
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
Public/Granted literature
- US20090137073A1 LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2009-05-28
Information query
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