摘要:
A liquid leak detection sensor has a sensitivity adjustable function, which adjusts a time to sense, that is, the sensitivity of a sensor regardless of whether the viscosity of a leaked liquid is high or low since a sensing position of the sensor can be adjusted according to the viscosity of the leaked liquid and the tilt of an installation place. The sensor includes a fixing connection fixture having a fixing plate with a fixing hole and a connection part formed with an angle adjustment protrusion, which are integrally provided; an insertion connection fixture into which the angle adjustment protrusion of the fixing connection fixture is inserted; a housing coupled to the insertion connection fixture and a substrate inserted into the housing and having a light-receiving unit for receiving light and a light-emitting unit for emitting light; and a lens part installed in the housing.
摘要:
An active magnetic bearing includes a bearing housing, a bearing stator, a bearing armature, a position detector, a jacket, and a stress buffering member. The bearing stator is accommodated in the bearing housing to support rotation of a rotor by using a magnetic force. The bearing armature is disposed to be spaced apart from the bearing stator by an interval and fixed to the rotor. The position detector is installed in the bearing housing to detect a position of the rotor. The jacket is interposed between the bearing stator and the bearing armature to seal a space between the bearing stator and the bearing housing. The stress buffering member connected to opposite ends of the jacket and the bearing housing, to buffer a stress generated due to differences between thermal exposition coefficients and temperatures of the bearing housing and the jacket.
摘要:
The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要:
An LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The LED package includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
摘要:
The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要:
Embodiments may be directed to a liquid crystal display apparatus, including a plurality of pixels, wherein each pixel of the plurality of pixels includes a first sub-pixel and a second sub-pixel, wherein the first sub-pixel and the second sub-pixel of a same pixel receive a same data signal and gate signal, wherein the first sub-pixel and the second sub-pixel include a first pixel electrode and a second pixel electrode, respectively, and wherein the first pixel electrode and the second pixel electrode have a first voltage difference at least during a light-emitting period, when a backlight unit emits light.
摘要:
In a displacement sensor and a magnetic bearing system using the same, the displacement sensor includes: a first coil unit including at least one first coil; a second coil unit including at least one second coil differentially connected to one side of the at least one first coil of the first coil unit; a sensor drive means for supplying a first power source voltage and a second power source voltage having the same drive frequency to the first coil unit and the second coil unit, respectively; and a detection circuit for extracting displacement information from a differential signal produced by the first coil unit and the second coil unit due to a change in inductances of the at least one first coil and the at least one second coil according to a position change of a displacement measurement object.
摘要:
There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.
摘要:
A flexible display panel includes a non-flexible first substrate in a first display area, a flexible second substrate in a second display area, a light emitting unit on a side of the first and second substrates, and a thin film encapsulation member on the light emitting unit.