Invention Grant
- Patent Title: Electromagnetic bandgap structure and printed circuit board
- Patent Title (中): 电磁带隙结构和印刷电路板
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Application No.: US12222057Application Date: 2008-07-31
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Publication No.: US08310840B2Publication Date: 2012-11-13
- Inventor: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0079261 20070807; KR10-2008-0057462 20080618
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.
Public/Granted literature
- US20090038840A1 Electromagnetic bandgap structure and printed curcuit board Public/Granted day:2009-02-12
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