发明授权
- 专利标题: Electromagnetic bandgap structure and printed circuit board
- 专利标题(中): 电磁带隙结构和印刷电路板
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申请号: US12222057申请日: 2008-07-31
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公开(公告)号: US08310840B2公开(公告)日: 2012-11-13
- 发明人: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- 申请人: Han Kim , Je-Gwang Yoo , Chang-Sup Ryu
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0079261 20070807; KR10-2008-0057462 20080618
- 主分类号: H05K7/00
- IPC分类号: H05K7/00
摘要:
Disclosed are an electromagnetic bandgap structure and a printed circuit board including the same. In accordance with an embodiment of the present invention, the printed circuit board can include a dielectric layer, a plurality of conductive plates, and a stitching via, which is configured to electrically connect the conductive plates to each other. The stitching via can pass through the dielectric layer, and a part of the stitching via can be placed in a planar surface that is different from a planar surface in which the conductive plates are placed. With the present invention, the electromagnetic bandgap structure can prevent a signal of a predetermined frequency band from being transferred.
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