发明授权
- 专利标题: Method of packaging electron emission device
- 专利标题(中): 包装电子发射装置的方法
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申请号: US13046703申请日: 2011-03-12
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公开(公告)号: US08313356B2公开(公告)日: 2012-11-20
- 发明人: Po-Hung Wang , Jung-Yu Li , Shih-Pu Chen , Yi-Ping Lin , Yen-I Chou , Ming-Chung Liu
- 申请人: Po-Hung Wang , Jung-Yu Li , Shih-Pu Chen , Yi-Ping Lin , Yen-I Chou , Ming-Chung Liu
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Jianq Chyun IP Office
- 优先权: TW97147162A 20081204
- 主分类号: H01J9/38
- IPC分类号: H01J9/38
摘要:
An electron emission device including a first substrate, a second substrate, a gas, a sealant, and a phosphor layer is provided. The first substrate has a cathode thereon, and the cathode has a patterned profile. The second substrate is opposite to the first substrate and has an anode thereon. The sealant is disposed at edges of the first substrate and the second substrate to assemble the first and second substrates. The gas is disposed between the cathode and the anode and configured to induce a plurality of electrons from the cathode, wherein the pressure of the gas is between 10 torr and 10−3 torr. The phosphor layer is disposed on the moving path of the electrons to react with the electrons so as to emit light.
公开/授权文献
- US20110183576A1 METHOD OF PACKAGING ELECTRON EMISSION DEVICE 公开/授权日:2011-07-28
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