Invention Grant
- Patent Title: Insulation paper with high thermal conductivity materials
- Patent Title (中): 绝热纸具有高导热性的材料
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Application No.: US12837582Application Date: 2010-07-16
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Publication No.: US08313832B2Publication Date: 2012-11-20
- Inventor: James D Smith , Gary Stevens , John W Wood
- Applicant: James D Smith , Gary Stevens , John W Wood
- Applicant Address: US FL Orlando
- Assignee: Siemens Energy, Inc.
- Current Assignee: Siemens Energy, Inc.
- Current Assignee Address: US FL Orlando
- Main IPC: B32B5/16
- IPC: B32B5/16 ; D21F11/00 ; D21H11/00
Abstract:
The present invention provides for a high thermal conductivity (HTC) paper that comprises a host matrix, such as mica, and HTC materials intercalated into the host matrix. The HTC materials are comprised of at least one of nanofillers, diamond like coatings directly on the host matrix, and diamond like coatings on the nanofillers.
Public/Granted literature
- US20100276628A1 INSULATION PAPER WITH HIGH THERMAL CONDUCTIVITY MATERIALS Public/Granted day:2010-11-04
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