发明授权
- 专利标题： Magnetic microelectronic device attachment
- 专利标题（中）： 磁微电子器件附件
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申请号： US12778335申请日： 2010-05-12
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公开(公告)号： US08313958B2公开(公告)日： 2012-11-20
- 发明人: Rajasekaran Swaminathan , Ravindranath Mahajan , John S. Guzek
- 申请人： Rajasekaran Swaminathan , Ravindranath Mahajan , John S. Guzek
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
The present disclosure relates to the field of fabricating microelectronic packages, wherein microelectronic devices of the microelectronic packages may have magnetic attachment structures comprising a magnetic material formed on an attachment structure. The microelectronic device may be aligned on a substrate with a magnetic field and then held in place therewith while being attached to the substrate. The microelectronic device may also be aligned with an alignment plate which magnetically aligns and holds the component in place while being packaged.
公开/授权文献
- US20110281375A1 MAGNETIC MICROELECTRONIC DEVICE ATTACHMENT 公开/授权日：2011-11-17
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