Invention Grant
US08314338B2 Wired circuit board and connection structure between wired circuit boards
有权
有线电路板和有线电路板之间的连接结构
- Patent Title: Wired circuit board and connection structure between wired circuit boards
- Patent Title (中): 有线电路板和有线电路板之间的连接结构
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Application No.: US12219343Application Date: 2008-07-21
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Publication No.: US08314338B2Publication Date: 2012-11-20
- Inventor: Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
- Applicant: Jun Ishii , Yasunari Ooyabu , Takeshi Tanaka , Toshiki Naito
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2007-189942 20070720
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11 ; H05K1/14
Abstract:
A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface.
Public/Granted literature
- US20090044969A1 Wired circuit board and connection structure between wired circuit boards Public/Granted day:2009-02-19
Information query
