A semiconductor package and mounting method of improving reliability by strengthening adhesive strength of both a printed circuit board and a surface mounting package, includes a chip pad on which a semiconductor device is disposed, and lead terminals, wherein at least one of the chip pad and the lead terminals have a plurality of grooves. Accordingly, in comparison with a typical package, since a plurality of grooves are formed on both a chip pad and lead terminals of a package adhering to a printed circuit, an adhesive area of both the package and the cream solder is widened so that the shearing strength may be improved and greater solder joint reliability can be acquired.