Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12978527Application Date: 2010-12-24
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Publication No.: US08320137B2Publication Date: 2012-11-27
- Inventor: Cheng-Hsien Lee , Yung-Chieh Chen , Shou-Kuo Hsu , Shin-Ting Yen
- Applicant: Cheng-Hsien Lee , Yung-Chieh Chen , Shou-Kuo Hsu , Shin-Ting Yen
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99142927A 20101209
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/06 ; H05K7/08 ; H05K7/10

Abstract:
A printed circuit board includes a high-speed differential signal control chip, first to eighth coupling capacitor pads, first to fourth connector pads, a first transmission line, a second transmission line, a third transmission line, a fourth transmission line, first to eighth transmission lines, two ninth transmission lines, first and second vias, and first to fourth sharing pads. The printed circuit board is operable to selectively support multiple connectors.
Public/Granted literature
- US20120147579A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-06-14
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