发明授权
- 专利标题: Fine processing method for a material of sintered diamond with a laser beam, a cutter wheel for a substrate made of a brittle material and its producing method thereof
- 专利标题(中): 具有激光束的烧结金刚石材料的精加工方法,由脆性材料制成的基板用切割轮及其制造方法
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申请号: US11815318申请日: 2006-02-02
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公开(公告)号: US08324528B2公开(公告)日: 2012-12-04
- 发明人: Mikio Kondo , Kazuhisa Kuriyama , Hiroshi Tomimori
- 申请人: Mikio Kondo , Kazuhisa Kuriyama , Hiroshi Tomimori
- 申请人地址: JP Osaka
- 专利权人: Mitsuboshi Diamond Industrial Co., Ltd
- 当前专利权人: Mitsuboshi Diamond Industrial Co., Ltd
- 当前专利权人地址: JP Osaka
- 代理机构: Antonelli, Terry, Stout & Kraus, LLP.
- 优先权: JP2005-026710 20050202
- 国际申请: PCT/JP2006/301783 WO 20060202
- 国际公布: WO2006/082899 WO 20060810
- 主分类号: B23K26/38
- IPC分类号: B23K26/38
摘要:
The present invention provides a manufacturing method for accurate, fine and efficient processing of a work piece to be processed and prevention of graphitization of the work piece to be processed, when sintered diamond is processed by a laser beam.The method provides process comprising steps of (a) irradiating outer circumference of a scribing wheel 2 with a laser beam from the side of the wheel, (b) moving the laser beam relative to the wheel 2, (c) forming continuously along the circumferential direction in the required space fine grooves with openings directed radially on a ridge site, (d) irradiating the laser beam onto the site to be processed at a speed of the laser beam relative to the work piece, and (e) forming the work piece into a minute shape within a depth of less than 200 μm.
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