公开(公告)号：US5955212A

公开(公告)日：1999-09-21

申请号：US256788

申请日：1994-10-28

申请人： Yasushi Matsumoto ,  Kazuhito Nishimura ,  Hiroshi Tomimori ,  Akio Hara

发明人： Yasushi Matsumoto ,  Kazuhito Nishimura ,  Hiroshi Tomimori ,  Akio Hara

IPC分类号： C23C16/02 ,  C23C16/27 ,  C23C16/00 ,  B23B3/00

CPC分类号： C23C16/0227 ,  C23C16/0209 ,  C23C16/0218 ,  C23C16/271 ,  Y10T428/12576

摘要： The present invention provides a superhard film-coated member having a diamond or diamond-like carbon film strongly bonded to a cemented carbide substrate and a method of manufacturing such a member. The cemented carbide substrate is subjected to heat treatment to cause the bonding metal in a region of the substrate near to its surface to migrate to the surface so as to form hemispherical deposits thereon. The deposits are left undisturbed or a part or all thereof are removed, and subsequently diamond and/or diamond-like carbon is grown on the substrate surface by a chemical vapor deposition process. The deposits formed on the substrate surface have the effect of significantly improving the bonding strength between the superhard films and the cemented carbide substrate to allow formation of thicker film coatings.

摘要翻译： PCT No.PCT / JP93 / 01779 Sec。 371日期：1994年10月28日 102（e）日期1994年10月28日PCT提交1993年12月8日PCT公布。 公开号WO94 / 13852 日期：1994年6月23日本发明提供一种具有与硬质合金基板牢固结合的金刚石或类金刚石碳膜的超硬膜涂层构件及其制造方法。 对硬质合金基板进行热处理，使基板的表面附近的接合金属迁移到表面，从而在其上形成半球状的沉积物。 沉积物不受干扰或其一部分或全部被除去，随后通过化学气相沉积工艺在衬底表面上生长金刚石和/或类金刚石碳。 形成在基板表面上的沉积物具有显着提高超硬膜和硬质合金基底之间的结合强度以形成较厚的膜涂层的效果。

公开(公告)号：US08324528B2

公开(公告)日：2012-12-04

申请号：US11815318

申请日：2006-02-02

申请人： Mikio Kondo ,  Kazuhisa Kuriyama ,  Hiroshi Tomimori

发明人： Mikio Kondo ,  Kazuhisa Kuriyama ,  Hiroshi Tomimori

IPC分类号： B23K26/38

CPC分类号： B23K26/0622 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/50 ,  B28D1/225 ,  B28D5/0011 ,  C03B33/107

摘要： The present invention provides a manufacturing method for accurate, fine and efficient processing of a work piece to be processed and prevention of graphitization of the work piece to be processed, when sintered diamond is processed by a laser beam.The method provides process comprising steps of (a) irradiating outer circumference of a scribing wheel 2 with a laser beam from the side of the wheel, (b) moving the laser beam relative to the wheel 2, (c) forming continuously along the circumferential direction in the required space fine grooves with openings directed radially on a ridge site, (d) irradiating the laser beam onto the site to be processed at a speed of the laser beam relative to the work piece, and (e) forming the work piece into a minute shape within a depth of less than 200 μm.

摘要翻译： 本发明提供了一种用于当通过激光束处理烧结金刚石时，待加工的工件的精确，精细和有效的加工的制造方法以及防止待加工的工件的石墨化。 该方法提供了以下步骤：（a）用来自轮侧的激光束照射划线轮2的外圆周，（b）相对于车轮2移动激光束，（c）沿圆周方向连续形成 （d）以激光束相对于工件的速度将激光束照射到待处理的位置上，以及（e）形成工件 在小于200μm的深度内形成微小的形状。

公开(公告)号：US20090039061A1

公开(公告)日：2009-02-12

申请号：US11815318

申请日：2006-02-02

申请人： Mikio Kondo ,  Kazuhisa Kuriyama ,  Hiroshi Tomimori

发明人： Mikio Kondo ,  Kazuhisa Kuriyama ,  Hiroshi Tomimori

IPC分类号： B23K26/38

CPC分类号： B23K26/0622 ,  B23K26/082 ,  B23K26/0823 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/50 ,  B28D1/225 ,  B28D5/0011 ,  C03B33/107

摘要： The present invention provides a manufacturing method for accurate, fine and efficient processing of a work piece to be processed and prevention of graphitization of the work piece to be processed, when sintered diamond is processed by a laser beam.The method provides process comprising steps of (a) irradiating outer circumference of a scribing wheel 2 with a laser beam from the side of the wheel, (b) moving the laser beam relative to the wheel 2, (c) forming continuously along the circumferential direction in the required space fine grooves with openings directed radially on a ridge site, (d) irradiating the laser beam onto the site to be processed at a speed of the laser beam relative to the work piece, and (e) forming the work piece into a minute shape within a depth of less than 200 μm.

摘要翻译： 本发明提供了一种用于当通过激光束处理烧结金刚石时，待加工的工件的精确，精细和有效的加工的制造方法以及防止待加工的工件的石墨化。 该方法提供了以下步骤：（a）用来自轮侧的激光束照射划线轮2的外圆周，（b）相对于车轮2移动激光束，（c）沿圆周方向连续形成 （d）以激光束相对于工件的速度将激光束照射到待处理的位置上，以及（e）形成工件 在小于200μm的深度内变成微小的形状。

公开(公告)号：US20110132954A1

公开(公告)日：2011-06-09

申请号：US12996199

申请日：2009-06-03

申请人： Maoko Tomei ,  Keitaro Okamoto ,  Hiroshi Tomimori

发明人： Maoko Tomei ,  Keitaro Okamoto ,  Hiroshi Tomimori

IPC分类号： B28D5/00 ,  B26D3/08 ,  B26F3/00

CPC分类号： B28D1/225 ,  Y10T83/0341 ,  Y10T83/0385 ,  Y10T225/12

摘要： A scribing wheel having a long life with little wear at the blade even when used to scribe a substrate that is relatively hard, such as a ceramic substrate, which can create deep vertical cracks if necessary is provided. A number of grooves 13 are created with predetermined intervals at the blade 12 that is along the ridgeline of the wheel of which the outer diameter is within a range of 1 mm to 5 mm. The depth D of these grooves 13 is 25 μm or more and the length of the ridgeline 14 between grooves is 25 μm or more. It is preferable for the pitch P of the grooves 13 to be in a range from 50 μm to 200 μm.

摘要翻译： 一种划线轮具有寿命长，甚至在用于划分相对较硬的基底（例如陶瓷基底）的情况下几乎不会磨损刀片，如果需要，可以产生深的垂直裂纹。 在叶片12处沿着外径在1mm至5mm的范围内的轮的脊线上以预定间隔形成多个凹槽13。 这些槽13的深度D为25μm以上，槽之间的棱线14的长度为25μm以上。 凹槽13的间距P优选在50μm至200μm的范围内。

公开(公告)号：US20050016351A1

公开(公告)日：2005-01-27

申请号：US10497968

申请日：2002-12-18

申请人： Hiroshi Tomimori

发明人： Hiroshi Tomimori

IPC分类号： B28D1/22 ,  C03B33/10 ,  B26F3/00

CPC分类号： C03B33/107 ,  B28D1/225 ,  C03B33/10 ,  Y10T83/0341 ,  Y10T83/9464 ,  Y10T225/10

摘要： A chip holder has a cutter chip having a conical shaft at both sides thereof. Concaves for supporting the cutter chip are bell-shaped having a curve with a predetermined radius of curvature. In an example, solid lubricant may be supplied from the outside of the holder to the concave of the chip holder. Thus the life of the cutter chip can be extended.

摘要翻译： 芯片保持器具有在其两侧具有锥形轴的切割器芯片。 用于支撑切割器芯片的凹部具有具有预定曲率半径的曲线的钟形。 在一个实例中，固体润滑剂可以从保持器的外部供应到芯片保持器的凹部。 因此，刀片寿命可以延长。