发明授权
US08324704B2 Silicon carbide semiconductor device with Schottky barrier diode and method of manufacturing the same
有权
具有肖特基势垒二极管的碳化硅半导体器件及其制造方法
- 专利标题: Silicon carbide semiconductor device with Schottky barrier diode and method of manufacturing the same
- 专利标题(中): 具有肖特基势垒二极管的碳化硅半导体器件及其制造方法
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申请号: US12659853申请日: 2010-03-23
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公开(公告)号: US08324704B2公开(公告)日: 2012-12-04
- 发明人: Takeo Yamamoto , Takeshi Endo , Eiichi Okuno , Hirokazu Fujiwara , Masaki Konishi , Takashi Katsuno , Yukihiko Watanabe
- 申请人: Takeo Yamamoto , Takeshi Endo , Eiichi Okuno , Hirokazu Fujiwara , Masaki Konishi , Takashi Katsuno , Yukihiko Watanabe
- 申请人地址: JP Kariya JP Toyota-shi
- 专利权人: DENSO CORPORATION,Toyota Jidosha Kabushiki Kaisha
- 当前专利权人: DENSO CORPORATION,Toyota Jidosha Kabushiki Kaisha
- 当前专利权人地址: JP Kariya JP Toyota-shi
- 代理机构: Posz Law Group, PLC
- 优先权: JP2009-71827 20090324
- 主分类号: H01L29/24
- IPC分类号: H01L29/24 ; H01L29/47 ; H01L21/04
摘要:
A silicon carbide semiconductor device with a Schottky barrier diode includes a first conductivity type silicon carbide substrate, a first conductivity type silicon carbide drift layer on a first surface of the substrate, a Schottky electrode forming a Schottky contact with the drift layer, and an ohmic electrode on a second surface of the substrate. The Schottky electrode includes an oxide layer in direct contact with the drift layer. The oxide layer is made of an oxide of molybdenum, titanium, nickel, or an alloy of at least two of these elements.
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