发明授权
US08324727B2 Low profile discrete electronic components and applications of same 有权
薄型离散电子元件及其应用

Low profile discrete electronic components and applications of same
摘要:
Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
信息查询
0/0