发明授权
US08328066B2 Bonding tool and electronic component mounting apparatus and method
有权
接合工具及电子部件安装装置及方法
- 专利标题: Bonding tool and electronic component mounting apparatus and method
- 专利标题(中): 接合工具及电子部件安装装置及方法
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申请号: US12711744申请日: 2010-02-24
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公开(公告)号: US08328066B2公开(公告)日: 2012-12-11
- 发明人: Ryo Fujita , Hiroshi Ebihara , Katsuhiko Watanabe
- 申请人: Ryo Fujita , Hiroshi Ebihara , Katsuhiko Watanabe
- 申请人地址: JP Osaka
- 专利权人: Panasonic Corporation
- 当前专利权人: Panasonic Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: RatnerPrestia
- 优先权: JP2009-048443 20090302; JP2010-027755 20100210
- 主分类号: B23K1/06
- IPC分类号: B23K1/06
摘要:
A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other.
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