发明授权
- 专利标题： Method for stacking devices
- 专利标题（中）： 堆放设备的方法
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申请号： US12163464申请日： 2008-06-27
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公开(公告)号： US08334170B2公开(公告)日： 2012-12-18
- 发明人: Dean Wang , Chien-Hsiun Lee , Chen-Shien Chen , Clinton Chao , Mirng-Ji Lii , Tjandra Winata Karta
- 申请人： Dean Wang , Chien-Hsiun Lee , Chen-Shien Chen , Clinton Chao , Mirng-Ji Lii , Tjandra Winata Karta
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Haynes and Boone, LLP
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/56
摘要：
A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.
公开/授权文献
- US20090321948A1 METHOD FOR STACKING DEVICES 公开/授权日：2009-12-31
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