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US08334209B2 Method of reducing electron beam damage on post W-CMP wafers 有权
减少后置W-CMP晶片电子束损伤的方法

Method of reducing electron beam damage on post W-CMP wafers
Abstract:
Methods for reducing electron beam induced damage on semiconductor substrates employ compositions such as small chain organic solvents and non-neutral pH solutions to reduce or eliminate charge imbalances on semiconductor substrates caused by electron beam inspection of the semiconductor substrates. Damage to semiconductor substrates by electron beam inspection processes may also be reduced by generating or otherwise forming passivation films on a semiconductor substrate following electron beam inspection.
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