发明授权
- 专利标题： Stacked semiconductor chips with separate encapsulations
- 专利标题（中）： 堆叠的半导体芯片具有单独的封装
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申请号： US13110372申请日： 2011-05-18
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公开(公告)号： US08334586B2公开(公告)日： 2012-12-18
- 发明人: Ralf Otremba , Josef Hoeglauer , Xaver Schloegel , Soon Hock Tong , Kwai Hong Wong
- 申请人： Ralf Otremba , Josef Hoeglauer , Xaver Schloegel , Soon Hock Tong , Kwai Hong Wong
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/495
摘要：
Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane.
公开/授权文献
- US20110215460A1 STACKED SEMICONDUCTOR CHIPS 公开/授权日：2011-09-08
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