发明授权
- 专利标题： System and method for multi-chip module die extraction and replacement
- 专利标题（中）： 多芯片模块提取和更换的系统和方法
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申请号： US13245909申请日： 2011-09-27
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公开(公告)号： US08338230B2公开(公告)日： 2012-12-25
- 发明人: John A. Hughes , Thomas E. Love , Eugene Lemoine , David H. Lee , Christopher Ebel
- 申请人： John A. Hughes , Thomas E. Love , Eugene Lemoine , David H. Lee , Christopher Ebel
- 申请人地址： US NH Nashua
- 专利权人： BAE Systems Information and Electronic Systems Integration Inc.
- 当前专利权人： BAE Systems Information and Electronic Systems Integration Inc.
- 当前专利权人地址： US NH Nashua
- 代理机构： Graybeal Jackson Haley
- 代理商 Daniel J. Long
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
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