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公开(公告)号：US08067829B2
公开(公告)日：2011-11-29
申请号：US12432672
申请日：2009-04-29
IPC分类号： H01L23/02
CPC分类号： H01L23/147 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/98 , H01L25/0657 , H01L2224/13099 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15165 , H01L2924/157 , H01L2924/3512 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
摘要翻译： 提供了一种系统和方法，其中堆叠的多芯片模块配置中的第一芯片经由一个或多个粘合层固定到分隔插入器单元的第一部分。 插入器的平面分隔物通过多个焊接“凸起”物理地结合，其具有高拉伸强度但对水平剪切力或扭矩的低阻力。 第二芯片通过一个或多个粘合层固定到分隔插入件的第二部分。 因此，芯片可以通过水平和相对地剪切或扭转分隔的插入器的第一和第二部分彼此远离而分开。
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2.发明申请公开(公告)号：US20100276794A1
公开(公告)日：2010-11-04
申请号：US12432672
申请日：2009-04-29
CPC分类号： H01L23/147 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/98 , H01L25/0657 , H01L2224/13099 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15165 , H01L2924/157 , H01L2924/3512 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
摘要翻译： 提供了一种系统和方法，其中堆叠的多芯片模块配置中的第一芯片经由一个或多个粘合层固定到分隔插入器单元的第一部分。 插入器的平面分隔物通过多个焊接“凸起”物理地结合，其具有高拉伸强度但对水平剪切力或扭矩的低阻力。 第二芯片通过一个或多个粘合层固定到分隔插入件的第二部分。 因此，芯片可以通过水平和相对地剪切或扭转分隔的插入器的第一和第二部分彼此远离而分开。
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3.发明授权Devices and methods for stacking individually tested devices to form multi-chip electronic modules 有权用于堆叠单独测试的设备以形成多芯片电子模块的设备和方法公开(公告)号：US08697457B1
公开(公告)日：2014-04-15
申请号：US13529267
申请日：2012-06-21
申请人： Keith K. Sturcken , John A. Hughes , Thomas E. Love , Sheila J. Konecke , Jeffrey Montag , Peter M. Wallace
发明人： Keith K. Sturcken , John A. Hughes , Thomas E. Love , Sheila J. Konecke , Jeffrey Montag , Peter M. Wallace
IPC分类号： G01R31/26
CPC分类号： H01L25/0657 , G01R31/003 , G01R31/2849 , G01R31/2855 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/15311 , H01L2924/15331
摘要： A method for manufacturing an electronic multi-chip module that involves stacking at least six tested devices to form the module. These devices may be individually tested prior to assembling the electronic module. After individually testing the devices, the devices may be stacked one on top of the other to form an electronic multi-chip module having at least six stacked devices. Other embodiments may be described and claimed.
摘要翻译： 一种用于制造电子多芯片模块的方法，其包括堆叠至少六个被测试的装置以形成模块。 这些设备可以在组装电子模块之前单独测试。 在对设备进行单独测试之后，可以将设备堆叠在一起而形成具有至少六个堆叠设备的电子多芯片模块。 可以描述和要求保护其他实施例。
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公开(公告)号：US08338230B2
公开(公告)日：2012-12-25
申请号：US13245909
申请日：2011-09-27
CPC分类号： H01L23/147 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/98 , H01L25/0657 , H01L2224/13099 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15165 , H01L2924/157 , H01L2924/3512 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
摘要翻译： 提供了一种系统和方法，其中堆叠的多芯片模块配置中的第一芯片经由一个或多个粘合层固定到分隔插入器单元的第一部分。 内插器的平面分隔物通过多个焊料凸点物理地结合，这些焊料具有高抗拉强度，但对水平剪切力或扭矩的抵抗力低。 第二芯片通过一个或多个粘合层固定到分隔插入件的第二部分。 因此，芯片可以通过水平和相对地剪切或扭转分隔的插入器的第一和第二部分彼此远离而分开。
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5.发明申请公开(公告)号：US20120015480A1
公开(公告)日：2012-01-19
申请号：US13245909
申请日：2011-09-27
申请人： John A. Hughes , Thomas E. Love , Eugene Lemoine , Christopher Ebel , David Lee
发明人： John A. Hughes , Thomas E. Love , Eugene Lemoine , Christopher Ebel , David Lee
IPC分类号： H01L21/58
CPC分类号： H01L23/147 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/98 , H01L25/0657 , H01L2224/13099 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/73265 , H01L2224/83102 , H01L2224/92125 , H01L2225/0651 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01033 , H01L2924/014 , H01L2924/14 , H01L2924/15165 , H01L2924/157 , H01L2924/3512 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
摘要翻译： 提供了一种系统和方法，其中堆叠的多芯片模块配置中的第一芯片经由一个或多个粘合层固定到分隔插入器单元的第一部分。 插入器的平面分隔物通过多个焊接“凸起”物理地结合，其具有高拉伸强度但对水平剪切力或扭矩的低阻力。 第二芯片通过一个或多个粘合层固定到分隔插入件的第二部分。 因此，芯片可以通过水平和相对地剪切或扭转分隔的插入器的第一和第二部分彼此远离而分开。
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