发明授权
- 专利标题： Multiple die face-down stacking for two or more die
- 专利标题（中）： 多个模具面朝下堆叠两个或更多个模具
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申请号： US13306300申请日： 2011-11-29
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公开(公告)号： US08338963B2公开(公告)日： 2012-12-25
- 发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
- 申请人： Belgacem Haba , Wael Zohni , Richard Dewitt Crisp , Ilyas Mohammed
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned with the first opening, a rear surface remote therefrom, and an edge extending between the front and rear surfaces. The second microelectronic element has a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening.
公开/授权文献
- US20120267798A1 MULTIPLE DIE FACE-DOWN STACKING FOR TWO OR MORE DIE 公开/授权日：2012-10-25
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