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公开(公告)号：US08823165B2
公开(公告)日：2014-09-02
申请号：US13346185
申请日：2012-01-09
IPC分类号： H01L23/34
CPC分类号： H01L23/481 , G11C5/04 , H01L23/12 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49838 , H01L23/538 , H01L23/5386 , H01L24/06 , H01L24/09 , H01L24/29 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L27/108 , H01L2224/0401 , H01L2224/061 , H01L2224/091 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/301 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of terminals exposed at the second surface. Each pair of microelectronic elements can include an upper microelectronic element and a lower microelectronic element. The pairs of microelectronic elements can be fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate. Each lower microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. A surface of each of the upper microelectronic elements can at least partially overlie a rear surface of the lower microelectronic element in its pair. The microelectronic package can also include electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals.
摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，至少两对微电子元件和在第二表面处暴露的多个端子。 每对微电子元件可以包括上微电子元件和下微电子元件。 这些微电子元件对可以在平行于衬底的第一表面的水平方向上彼此完全间隔开。 每个下部微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 每个上部微电子元件的表面可以至少部分地覆盖在其对中的下部微电子元件的后表面。 微电子封装还可以包括从每个下部微电子元件的至少一些触点延伸到至少一些端子的电连接。
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公开(公告)号：US20130015591A1
公开(公告)日：2013-01-17
申请号：US13346201
申请日：2012-01-09
IPC分类号： H01L23/52
CPC分类号： H01L25/0655 , G11C5/04 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49838 , H01L24/06 , H01L24/29 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01076 , H01L2924/01322 , H01L2924/014 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. The front surfaces of the microelectronic elements can be arranged in a single plane parallel to the first surface. Each microelectronic element can have a column of contacts exposed at the front surface and arranged along respective first, second, third, and fourth axes. The first and third axes can be parallel to one another. The second and fourth axes can be transverse to the first and third axes. The microelectronic package can also include electrical connections extending from at least some of the contacts of each microelectronic element to at least some of the terminals.
摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，第一，第二，第三和第四微电子元件以及在第二表面处暴露的多个端子。 每个微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 微电子元件的前表面可以布置在平行于第一表面的单个平面中。 每个微电子元件可以具有在前表面处暴露并且沿着相应的第一，第二，第三和第四轴线布置的触点列。 第一和第三轴线可以彼此平行。 第二和第四轴线可以横向于第一和第三轴线。 微电子封装还可以包括从每个微电子元件的至少一些触点延伸到至少一些端子的电连接。
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公开(公告)号：US08513817B2
公开(公告)日：2013-08-20
申请号：US13346201
申请日：2012-01-09
IPC分类号： H01L23/52
CPC分类号： H01L25/0655 , G11C5/04 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49838 , H01L24/06 , H01L24/29 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/0401 , H01L2224/06135 , H01L2224/06136 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06568 , H01L2225/06589 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01076 , H01L2924/01322 , H01L2924/014 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate having first and second opposed surfaces, first, second, third, and fourth microelectronic elements, and a plurality of terminals exposed at the second surface. Each microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. The front surfaces of the microelectronic elements can be arranged in a single plane parallel to the first surface. Each microelectronic element can have a column of contacts exposed at the front surface and arranged along respective first, second, third, and fourth axes. The first and third axes can be parallel to one another. The second and fourth axes can be transverse to the first and third axes. The microelectronic package can also include electrical connections extending from at least some of the contacts of each microelectronic element to at least some of the terminals.
摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，第一，第二，第三和第四微电子元件以及在第二表面处暴露的多个端子。 每个微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 微电子元件的前表面可以布置在平行于第一表面的单个平面中。 每个微电子元件可以具有在前表面处暴露并且沿着相应的第一，第二，第三和第四轴线布置的触点列。 第一和第三轴线可以彼此平行。 第二和第四轴线可以横向于第一和第三轴线。 微电子封装还可以包括从每个微电子元件的至少一些触点延伸到至少一些端子的电连接。
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公开(公告)号：US20130015590A1
公开(公告)日：2013-01-17
申请号：US13346185
申请日：2012-01-09
IPC分类号： H01L23/48
CPC分类号： H01L23/481 , G11C5/04 , H01L23/12 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/49838 , H01L23/538 , H01L23/5386 , H01L24/06 , H01L24/09 , H01L24/29 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L27/108 , H01L2224/0401 , H01L2224/061 , H01L2224/091 , H01L2224/16225 , H01L2224/16227 , H01L2224/291 , H01L2224/2919 , H01L2224/29193 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2924/00014 , H01L2924/01322 , H01L2924/1203 , H01L2924/1205 , H01L2924/1431 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1438 , H01L2924/1443 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/18165 , H01L2924/19041 , H01L2924/19105 , H01L2924/301 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of terminals exposed at the second surface. Each pair of microelectronic elements can include an upper microelectronic element and a lower microelectronic element. The pairs of microelectronic elements can be fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate. Each lower microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. A surface of each of the upper microelectronic elements can at least partially overlie a rear surface of the lower microelectronic element in its pair. The microelectronic package can also include electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals.
摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底，至少两对微电子元件和在第二表面处暴露的多个端子。 每对微电子元件可以包括上微电子元件和下微电子元件。 这些微电子元件对可以在平行于衬底的第一表面的水平方向上彼此完全间隔开。 每个下部微电子元件可以具有面向基板的第一表面的前表面和在前表面处的多个触点。 每个上部微电子元件的表面可以至少部分地覆盖在其对中的下部微电子元件的后表面。 微电子封装还可以包括从每个下部微电子元件的至少一些触点延伸到至少一些端子的电连接。
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公开(公告)号：US08338963B2
公开(公告)日：2012-12-25
申请号：US13306300
申请日：2011-11-29
IPC分类号： H01L23/52
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/18 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L25/0652 , H01L25/50 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/4824 , H01L2224/50 , H01L2224/73215 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06586 , H01L2225/06589 , H01L2924/09701 , H01L2924/15311 , H01L2924/00
摘要： A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned with the first opening, a rear surface remote therefrom, and an edge extending between the front and rear surfaces. The second microelectronic element has a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening.
摘要翻译： 公开了一种微电子组件，其包括具有第一和第二开口的基板，第一微电子元件和面朝下位置的第二微电子元件。 第一元件具有面向基板的前表面的活动表面和与第一开口对准的接合垫，与其远离的后表面以及在前表面和后表面之间延伸的边缘。 第二微电子元件具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面，以及在第二微电子元件的前表面处与第二开口对准的接合焊盘。
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公开(公告)号：US20120267798A1
公开(公告)日：2012-10-25
申请号：US13306300
申请日：2011-11-29
IPC分类号： H01L23/50
CPC分类号： H01L25/0657 , H01L23/13 , H01L23/18 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L25/0652 , H01L25/50 , H01L2224/06136 , H01L2224/32145 , H01L2224/32225 , H01L2224/4824 , H01L2224/50 , H01L2224/73215 , H01L2225/0651 , H01L2225/06527 , H01L2225/06562 , H01L2225/06586 , H01L2225/06589 , H01L2924/09701 , H01L2924/15311 , H01L2924/00
摘要： A microelectronic assembly is disclosed that comprises a substrate having first and second openings, a first microelectronic element and a second microelectronic element in a face-down position. The first element has an active surface facing the front surface of the substrate and bond pads aligned with the first opening, a rear surface remote therefrom, and an edge extending between the front and rear surfaces. The second microelectronic element has a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, and bond pads at the front surface of the second microelectronic element aligned with the second opening.
摘要翻译： 公开了一种微电子组件，其包括具有第一和第二开口的基板，第一微电子元件和面朝下位置的第二微电子元件。 第一元件具有面向基板的前表面的活动表面和与第一开口对准的接合垫，与其远离的后表面以及在前表面和后表面之间延伸的边缘。 第二微电子元件具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面，以及在第二微电子元件的前表面处与第二开口对准的接合焊盘。
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7.发明授权公开(公告)号：US08610260B2
公开(公告)日：2013-12-17
申请号：US13439299
申请日：2012-04-04
IPC分类号： H01L23/48
CPC分类号： H01L23/49838 , G11C5/04 , G11C5/063 , H01L23/13 , H01L23/3114 , H01L23/3171 , H01L23/48 , H01L23/4824 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/52 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L27/108 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05554 , H01L2224/05569 , H01L2224/0557 , H01L2224/06156 , H01L2224/06164 , H01L2224/12105 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/81191 , H01L2224/81193 , H01L2224/81447 , H01L2224/81805 , H01L2224/9202 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2225/06589 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/3011 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.
摘要翻译： 微电子封装可以包括衬底和微电子元件，其具有面和在其上的一个或多个接触柱，其面对并连接到衬底的表面上的对应接触。 轴向平面可以沿着第一方向的线与面相交，并且相对于元件触点的列居中。 封装端子的列可以沿第一方向延伸。 可以将第二表面的中心区域中的第一端子配置为携带可用于确定微电子元件内的可寻址存储器位置的地址信息。 中心区域可以具有不大于封装端子列之间的最小间距的三倍和五倍的宽度。 轴向平面可以与中心区域相交。
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公开(公告)号：US08525327B2
公开(公告)日：2013-09-03
申请号：US13439286
申请日：2012-04-04
IPC分类号： H01L23/34 , H01L23/498
CPC分类号： H01L23/49838 , G11C5/04 , G11C5/063 , H01L23/13 , H01L23/3114 , H01L23/3171 , H01L23/48 , H01L23/4824 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/52 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/92 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/16 , H01L27/108 , H01L2224/0401 , H01L2224/04042 , H01L2224/04105 , H01L2224/05554 , H01L2224/05569 , H01L2224/0557 , H01L2224/06156 , H01L2224/06164 , H01L2224/12105 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2224/81191 , H01L2224/81193 , H01L2224/81447 , H01L2224/81805 , H01L2224/9202 , H01L2225/06506 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06551 , H01L2225/06562 , H01L2225/06565 , H01L2225/06589 , H01L2225/1023 , H01L2225/1064 , H01L2225/107 , H01L2924/00014 , H01L2924/01029 , H01L2924/01322 , H01L2924/1434 , H01L2924/1436 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/3011 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.
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9.发明授权Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate 有权使用组合中的重复信号端子的短截线最小化，而无需引线封装衬底公开(公告)号：US08436477B2
公开(公告)日：2013-05-07
申请号：US13439273
申请日：2012-04-04
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , G11C5/063 , H01L23/12 , H01L23/13 , H01L23/49838 , H01L23/50 , H01L24/17 , H01L24/19 , H01L24/20 , H01L24/24 , H01L25/0652 , H01L25/0655 , H01L2224/16225 , H01L2224/1715 , H01L2224/24145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/4824 , H01L2224/73204 , H01L2224/73215 , H01L2225/06506 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06572 , H01L2225/06575 , H01L2225/1023 , H01L2225/107 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , H01L2924/00012 , H01L2924/00
摘要： A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element can include a plurality of stacked electrically interconnected semiconductor chips. The substrate can have contacts facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations within the microelectronic element. The signal assignments of the first terminals in the first grid can be a mirror image of the signal assignments of the first terminals in the second grid.
摘要翻译： 微电子封装可以包括其上具有面和多个元件触点的微电子元件，具有第一和第二表面的衬底以及被配置为将封装与外部元件连接的第二表面上的端子。 微电子元件可以包括多个堆叠的电互连半导体芯片。 衬底可以具有面向微电子元件的元件触点并且与其接合的触点。 端子可以包括布置在第一和第二平行栅格内的位置处的第一端子。 每个电网的第一个端子可被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的所有可寻址的存储单元中确定可寻址的存储器位置。 第一网格中的第一终端的信号分配可以是第二网格中的第一终端的信号分配的镜像。
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10.发明申请公开(公告)号：US20130083583A1
公开(公告)日：2013-04-04
申请号：US13440515
申请日：2012-04-05
IPC分类号： G11C5/06
CPC分类号： H01L25/105 , H01L23/13 , H01L23/3128 , H01L23/49838 , H01L23/50 , H01L24/06 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/06136 , H01L2224/06156 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/107 , H01L2924/00014 , H01L2924/01087 , H01L2924/01322 , H01L2924/09701 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/19041 , H01L2924/19105 , H01L2924/19106 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.
摘要翻译： 微电子封装可以包括具有第一和第二相对表面的衬底以及在第一和第二表面之间延伸的第一和第二孔，第一和第二微电子元件各自具有面向衬底的第一表面的表面， 并且在每个微电子元件的触点和端子之间电连接引线。 孔可以具有在相应孔的长度方向上延伸的第一和第二平行轴线。 第二表面的中心区域可以设置在第一和第二轴线之间。 终端可以被配置为承载可由微电子封装内的电路使用的地址信息，以从微电子元件内的存储器存储阵列的所有可寻址的存储器位置中确定可寻址的存储器位置。
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