发明授权
US08343371B2 Apparatus and method for improving photoresist properties using a quasi-neutral beam 有权
使用准中性光束改善光致抗蚀剂性能的装置和方法

Apparatus and method for improving photoresist properties using a quasi-neutral beam
摘要:
The invention can provide apparatus and methods of processing a substrate in real-time using a Quasi-Neutral Beam (Q-NB) curing system to improve the etch resistance of photoresist layer. In addition, the improved photoresist layer can be used to more accurately control gate and/or spacer critical dimensions (CDs), to control gate and/or spacer CD uniformity, and to eliminate line edge roughness (LER) and line width roughness (LWR).
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