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发明授权
US08344497B2 Semiconductor package and electronic device having the same 有权
半导体封装和具有相同的电子器件

Semiconductor package and electronic device having the same
摘要：
A semiconductor package may include a semiconductor chip, a molding layer which molds the semiconductor chip, and an interconnection which extends crossing an interface between the semiconductor chip and the molding layer and connects the semiconductor chip to an outside, wherein a shape of the interconnection is changed along the extended length thereof. According to the present invention, even if a mechanical stress or a thermal stress is applied to an interconnection, a crack does not occur in the interconnection or the interconnection is not disconnected. Therefore, a reliability of the semiconductor package is improved.
摘要（中）：

半导体封装可以包括半导体芯片，模制半导体芯片的模制层和跨越半导体芯片和模制层之间的界面延伸并将半导体芯片连接到外部的互连，其中互连的形状是 沿其长度改变。 根据本发明，即使对互连件施加机械应力或热应力，在互连中也不会发生裂纹，也不会断开互连。 因此，提高了半导体封装的可靠性。

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