Invention Grant
- Patent Title: Methods for controlling bevel edge etching in a plasma chamber
- Patent Title (中): 用于控制等离子体室中的斜边蚀刻的方法
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Application No.: US13300483Application Date: 2011-11-18
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Publication No.: US08349202B2Publication Date: 2013-01-08
- Inventor: Tong Fang , Yunsang Kim , Andrew D. Bailey, III , Olivier Rigoutat , George Stojakovic
- Applicant: Tong Fang , Yunsang Kim , Andrew D. Bailey, III , Olivier Rigoutat , George Stojakovic
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Martine Penilla Group, LLP
- Main IPC: C23F1/00
- IPC: C23F1/00

Abstract:
Methods for bevel edge etching are provided. One example method is for etching a film on a bevel edge of a substrate in a plasma etching chamber. The method includes providing the substrate on a substrate support in the plasma etching chamber. The plasma etching chamber has a top edge electrode and a bottom edge electrode disposed to surround the substrate support. Then flowing an etching process gas through a plurality of edge gas feeds disposed along a periphery of the gas delivery plate. The periphery of the gas deliver plate is oriented above the substrate support and the bevel edge of the substrate, and the flowing is further directed to a space between the top edge electrode and bottom edge electrode. And, flowing a tuning gas through a center gas feed of the gas delivery plate.
Public/Granted literature
- US20120074099A1 Methods for Controlling Bevel Edge Etching in a Plasma Chamber Public/Granted day:2012-03-29
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