Invention Grant
- Patent Title: Encapsulated MEMS device and method to form the same
- Patent Title (中): 封装的MEMS器件和方法形成相同
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Application No.: US12124043Application Date: 2008-05-20
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Publication No.: US08349635B1Publication Date: 2013-01-08
- Inventor: Qing Gan , Emmanuel P. Quevy
- Applicant: Qing Gan , Emmanuel P. Quevy
- Applicant Address: US TX Austin
- Assignee: Silicon Laboratories Inc.
- Current Assignee: Silicon Laboratories Inc.
- Current Assignee Address: US TX Austin
- Agency: Zagorin O'Brien Graham LLP
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
An encapsulated MEMS device and a method to form an encapsulated MEMS device are described. An apparatus includes a first substrate having a silicon-germanium seal ring disposed thereon and a second substrate having a metal seal ring disposed thereon. The metal seal ring is aligned with and bonded to the silicon-germanium seal ring to provide a sealed cavity. A MEMS device is housed in the sealed cavity. A method includes forming a silicon-germanium seal ring on a first substrate and forming a metal seal ring on a second substrate. The metal seal ring is bonded to the silicon-germanium seal ring to provide a sealed cavity that houses a MEMS device.
Information query
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