Invention Grant
- Patent Title: Housing assembly for electronic device
- Patent Title (中): 电子设备外壳组件
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Application No.: US12797073Application Date: 2010-06-09
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Publication No.: US08350149B2Publication Date: 2013-01-08
- Inventor: Jung-Pin Chen , Shu-Chen Lin , Shan-Yao Chen
- Applicant: Jung-Pin Chen , Shu-Chen Lin , Shan-Yao Chen
- Applicant Address: TW Kaohsiung Hsien
- Assignee: King Slide Works Co., Ltd.
- Current Assignee: King Slide Works Co., Ltd.
- Current Assignee Address: TW Kaohsiung Hsien
- Agency: Rosenberg, Klein & Lee
- Priority: TW98119487A 20090610
- Main IPC: H01J5/00
- IPC: H01J5/00 ; H05K7/02 ; H04M1/00

Abstract:
A housing assembly includes a first housing having first positioning holes, a second housing having second positioning holes, and an assembly unit connected between the first and second housings and including two assembly parts. Multiple engaging devices each include a first engaging member and a second engaging member. The engaging devices are connected to the first and second positioning holes by first and second resilient members. An operation device is connected to the engaging devices and includes first and second release members which are respectively connected to the assembly parts. A link is connected to the assembly unit and connected with the first and second release members. An operation member is connected to the link to move the first or second release members of each engaging device and disengage the first and second release members from the first or second positioning holes of the first or second housings.
Public/Granted literature
- US20100317414A1 HOUSING ASSEMBLY FOR ELECTRONIC DEVICE Public/Granted day:2010-12-16
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