发明授权
- 专利标题: Structure, electronic device, and method for fabricating a structure
- 专利标题(中): 结构,电子器件和制造结构的方法
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申请号: US13060994申请日: 2008-08-25
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公开(公告)号: US08350160B2公开(公告)日: 2013-01-08
- 发明人: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Mariko Suzuki
- 申请人: Tadashi Sakai , Naoshi Sakuma , Masayuki Katagiri , Mariko Suzuki
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 国际申请: PCT/JP2008/065128 WO 20080825
- 国际公布: WO2010/023720 WO 20100304
- 主分类号: H05K1/09
- IPC分类号: H05K1/09
摘要:
A structure includes a conductive film (12) provided in an underlying layer (10); and a carbon nanotube bundle (20) including a plurality of carbon nanotubes each having one end connected to the conductive film (12), wherein, at other end side of the carbon nanotube bundle (20), at least carbon nanotubes allocated at outer side of the carbon nanotube bundle (20) extend with convex curvatures toward the outside of the carbon nanotube bundle (20), and the convex curvatures of the carbon nanotubes allocated at the outer side of the carbon nanotube bundle are larger than those of inner side of the carbon nanotube bundle (20), and diameters of the carbon nanotube bundle (20) decrease toward the other end of the carbon nanotube bundle (20).
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