发明授权
- 专利标题: Resistive random access memory having a solid solution layer and method of manufacturing the same
- 专利标题(中): 具有固溶层的电阻随机存取存储器及其制造方法
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申请号: US11984277申请日: 2007-11-15
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公开(公告)号: US08350247B2公开(公告)日: 2013-01-08
- 发明人: Myoung-jae Lee , Young-soo Park , Ran-ju Jung , Sun-ae Seo , Dong-chul Kim , Seung-eon Ahn
- 申请人: Myoung-jae Lee , Young-soo Park , Ran-ju Jung , Sun-ae Seo , Dong-chul Kim , Seung-eon Ahn
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Harness, Dickey & Pierce, P.L.C.
- 优先权: KR10-2006-0113385 20061116
- 主分类号: H01L47/00
- IPC分类号: H01L47/00
摘要:
A resistive random access memory (RRAM) having a solid solution layer and a method of manufacturing the RRAM are provided. The RRAM includes a lower electrode, a solid solution layer on the lower electrode, a resistive layer on the solid solution layer, and an upper electrode on the resistive layer. The method of manufacturing the RRAM includes forming a lower electrode, forming a solid solution layer on the lower electrode, forming a resistive layer on the solid layer and forming an upper electrode on the resistive layer, wherein the RRAM is formed of a transition metal solid solution.
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