Invention Grant
- Patent Title: Telecommunications chassis having mezzanine card slots
- Patent Title (中): 电信机箱有夹层卡槽
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Application No.: US12587824Application Date: 2009-10-14
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Publication No.: US08351198B2Publication Date: 2013-01-08
- Inventor: Edoardo Campini , Steven DeNies , Mark Summers , Lawson Guthrie
- Applicant: Edoardo Campini , Steven DeNies , Mark Summers , Lawson Guthrie
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
Embodiments are generally directed to a method and apparatus to couple a module to a management controller on an interconnect. In one embodiment, a method includes detecting that a module has coupled to an interconnect, the interconnect coupled to a modular platform backplane. The method further includes logically coupling the module to one of a plurality of management controllers resident on the interconnect, each management controller logically appears as a management controller for different interconnects coupled to the modular platform backplane.
Public/Granted literature
- US20100110645A1 Telecommuncations chassis having mezzanine card slots Public/Granted day:2010-05-06
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