发明授权
- 专利标题: Multi-layer diffusion medium substrate
- 专利标题(中): 多层扩散介质基板
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申请号: US11180423申请日: 2005-07-13
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公开(公告)号: US08354199B2公开(公告)日: 2013-01-15
- 发明人: Chunxin Ji , Mark Mathias , Jeanette E. O'Hara , Yeh-Hung Lai
- 申请人: Chunxin Ji , Mark Mathias , Jeanette E. O'Hara , Yeh-Hung Lai
- 申请人地址: US MI Detroit
- 专利权人: GM Global Technology Operations LLC
- 当前专利权人: GM Global Technology Operations LLC
- 当前专利权人地址: US MI Detroit
- 代理机构: BrooksGroup
- 主分类号: H01M8/10
- IPC分类号: H01M8/10 ; H01M8/24 ; H01M8/04 ; H01M4/64
摘要:
A multi-layer diffusion medium substrate having improved mechanical properties is disclosed. The diffusion medium substrate includes at least one stiff layer and at least one compressible layer. The at least one stiff layer has a greater stiffness in the x-y direction as compared to the at least one compressible layer. The at least one compressible layer has a greater compressibility in the z direction. A method of fabricating a multi-layer diffusion medium substrate is also disclosed.
公开/授权文献
- US20070015042A1 Multi-layer diffusion medium substrate 公开/授权日:2007-01-18
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