发明授权
US08354321B2 Method for fabricating semiconductor devices with reduced junction diffusion
有权
制造具有减小的结扩散的半导体器件的方法
- 专利标题: Method for fabricating semiconductor devices with reduced junction diffusion
- 专利标题(中): 制造具有减小的结扩散的半导体器件的方法
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申请号: US13277197申请日: 2011-10-19
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公开(公告)号: US08354321B2公开(公告)日: 2013-01-15
- 发明人: Benjamin Colombeau , Sai Hooi Yeong , Francis Benistant , Bangun Indajang , Lap Chan
- 申请人: Benjamin Colombeau , Sai Hooi Yeong , Francis Benistant , Bangun Indajang , Lap Chan
- 申请人地址: SG Singapore SG Singapore
- 专利权人: GLOBALFOUNDRIES Singapore Pte. Ltd.,National University of Singapore
- 当前专利权人: GLOBALFOUNDRIES Singapore Pte. Ltd.,National University of Singapore
- 当前专利权人地址: SG Singapore SG Singapore
- 代理机构: Horizon IP Pte Ltd
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L21/76
摘要:
A transistor which includes halo regions disposed in a substrate adjacent to opposing sides of the gate. The halo regions have upper and lower regions. The upper region is a crystalline region with excess vacancies and the lower region is an amorphous region. Source/drain diffusion regions are disposed in the halo regions. The source/drain diffusion regions overlap the upper and lower halo regions. This architecture offers the minimal extension resistance as well as minimum lateral diffusion for better CMOS device scaling.
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