Invention Grant
US08355661B2 Fusing device including resistive heating layer and image forming apparatus including the fusing device
有权
包括电阻加热层的定影装置和包括定影装置的图像形成装置
- Patent Title: Fusing device including resistive heating layer and image forming apparatus including the fusing device
- Patent Title (中): 包括电阻加热层的定影装置和包括定影装置的图像形成装置
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Application No.: US12853569Application Date: 2010-08-10
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Publication No.: US08355661B2Publication Date: 2013-01-15
- Inventor: Dong-earn Kim , In-taek Han , Ha-jin Kim , Sang-soo Jee , Sang-eui Lee
- Applicant: Dong-earn Kim , In-taek Han , Ha-jin Kim , Sang-soo Jee , Sang-eui Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0077162 20090820; KR10-2010-0057120 20100616
- Main IPC: G03G15/20
- IPC: G03G15/20
Abstract:
A fusing device includes; a heating member having a resistive heating layer constituting an outermost portion of the heating member, a nip forming member facing the heating member to form a fusing nip therewith, and a plurality of current supplying electrodes which contact an outer circumference of the resistive heating layer to supply electrical current to the resistive heating layer.
Public/Granted literature
- US20110044739A1 FUSING DEVICE INCLUDING RESISTIVE HEATING LAYER AND IMAGE FORMING APPARATUS INCLUDING THE FUSING DEVICE Public/Granted day:2011-02-24
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