Invention Grant
- Patent Title: Laser sealing of packages
- Patent Title (中): 激光封装封装
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Application No.: US12855953Application Date: 2010-08-13
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Publication No.: US08357875B2Publication Date: 2013-01-22
- Inventor: Elmar Ehrmann , Tieme Jan Slomp , Robert Maier
- Applicant: Elmar Ehrmann , Tieme Jan Slomp , Robert Maier
- Applicant Address: DE Wolfertschwenden
- Assignee: Multivac Sepp Haggenmuller GmbH & Co. KG
- Current Assignee: Multivac Sepp Haggenmuller GmbH & Co. KG
- Current Assignee Address: DE Wolfertschwenden
- Agency: Husch Blackwell LLP
- Priority: DE102009037404 20090813
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A device for welding a plurality of foils to one another by means of a laser, for use in a packaging machine, comprises a clamping unit configured for applying pressure to a plurality of foils in a predetermined area as well as for conducting the laser radiation used for the purpose of welding to this area. A method for welding a plurality of foils to one another by means of a laser in a sealing station comprises welding the foils to one another along a sealing seam by means of the radiation of the laser while pressing them together in the area of the sealing seam.
Public/Granted literature
- US20110036817A1 LASER SEALING OF PACKAGES Public/Granted day:2011-02-17
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