Invention Grant
US08361621B2 Additives for the use of microwave energy to selectively heat thermoplastic polymer systems
有权
使用微波能量选择性加热热塑性聚合物体系的添加剂
- Patent Title: Additives for the use of microwave energy to selectively heat thermoplastic polymer systems
- Patent Title (中): 使用微波能量选择性加热热塑性聚合物体系的添加剂
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Application No.: US12301934Application Date: 2007-05-31
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Publication No.: US08361621B2Publication Date: 2013-01-29
- Inventor: Michael Cook , Michael S. Paquette , Robert P. Haley, Jr. , Sam Crabtree , Jose Longoria , Saeed Siavoshani , Peter K. Mercure , Shih-Yaw Lai , Ronald G. Van Daele
- Applicant: Michael Cook , Michael S. Paquette , Robert P. Haley, Jr. , Sam Crabtree , Jose Longoria , Saeed Siavoshani , Peter K. Mercure , Shih-Yaw Lai , Ronald G. Van Daele
- Applicant Address: US DE Wilmington
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US DE Wilmington
- Agency: Osha Liang LLP
- International Application: PCT/US2007/012822 WO 20070531
- International Announcement: WO2007/143019 WO 20071213
- Main IPC: B32B27/20
- IPC: B32B27/20 ; C08K3/32
Abstract:
A microwave-sensitive thermoplastic composition that includes a microwave-receptive additive; and a thermoplastic polymer; wherein the microwave-receptive additive is selected from the group consisting of sepiolite clay, molecular sieves formed from ammonium ion salts or hydrogen ion salts, aluminophosphates, silicoaluminophasphates, silicotitanates, organo-modified clays, molecular sieves or zeolites having a caged organic microwave receptive material, and combinations thereof.
Public/Granted literature
- US20110104496A1 ADDITIVES FOR THE USE OF MICROWAVE ENERGY TO SELECTIVELY HEAT THERMOPLASTIC POLYMER SYSTEMS Public/Granted day:2011-05-05
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