发明授权
- 专利标题: Semiconductor device
- 专利标题(中): 半导体器件
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申请号: US12309245申请日: 2007-07-12
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公开(公告)号: US08362567B2公开(公告)日: 2013-01-29
- 发明人: Tadahiro Ohmi , Akinobu Teramoto , Rihito Kuroda
- 申请人: Tadahiro Ohmi , Akinobu Teramoto , Rihito Kuroda
- 申请人地址: JP Sendai-shi JP Tsukuba-shi
- 专利权人: National University Corporation Tohoku University,Foundation for Advancement of International Science
- 当前专利权人: National University Corporation Tohoku University,Foundation for Advancement of International Science
- 当前专利权人地址: JP Sendai-shi JP Tsukuba-shi
- 代理机构: Foley & Lardner LLP
- 优先权: JP2006-192440 20060713
- 国际申请: PCT/JP2007/063926 WO 20070712
- 国际公布: WO2008/007748 WO 20080117
- 主分类号: H01L21/70
- IPC分类号: H01L21/70
摘要:
In a semiconductor device, the degree of flatness of 0.3 nm or less in terms of a peak-to-valley (P-V) value is realized by rinsing a silicon surface with hydrogen-added ultrapure water in a light-screened state and in a nitrogen atmosphere and a contact resistance of 10−11 Ωcm2 or less is realized by setting a work function difference of 0.2 eV or less between an electrode and the silicon. Thus, the semiconductor device can operate on a frequency of 10 GHz or higher.
公开/授权文献
- US20100059830A1 Semiconductor device 公开/授权日:2010-03-11
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