- 专利标题: Digital slicing device
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申请号: US12313245申请日: 2008-11-18
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公开(公告)号: US08363754B2公开(公告)日: 2013-01-29
- 发明人: Liang-Wei Huang , Chih-Yung Shih , Shieh-Hsing Kuo
- 申请人: Liang-Wei Huang , Chih-Yung Shih , Shieh-Hsing Kuo
- 申请人地址: TW Hsinchu
- 专利权人: Realtek Semiconductor Corp.
- 当前专利权人: Realtek Semiconductor Corp.
- 当前专利权人地址: TW Hsinchu
- 代理机构: McClure, Qualey & Rodack, LLP
- 优先权: TW96144272A 20071122
- 主分类号: H03K9/00
- IPC分类号: H03K9/00 ; H04L27/14
摘要:
A digital slicing device is provided for making a numerical value determination with respect to an inputted modulated symbol so as to output a corresponding symbol. The digital slicing device includes a demodulating unit, a slicing unit and a re-modulating unit. The demodulating unit is for collecting at least two successive modulated symbols and for demodulating the two modulated symbols according to a modulation algorithm so as to generate two demodulated symbols. The slicing unit is for rounding the two demodulated symbols so as to generate two rounded demodulated symbols. The re-modulating unit is for re-modulating the two rounded demodulated symbols according to the modulation algorithm so as to generate two re-modulated symbols corresponding to the two modulated symbols. The two modulated symbols are generated simultaneously through conversion using the modulation algorithm.
公开/授权文献
- US20090135962A1 Digital slicing device 公开/授权日:2009-05-28