Invention Grant
- Patent Title: Optical interconnection arrangement for high speed, high density communication systems
- Patent Title (中): 用于高速,高密度通信系统的光互连布置
-
Application No.: US12796868Application Date: 2010-06-09
-
Publication No.: US08364042B2Publication Date: 2013-01-29
- Inventor: Kalpendu Shastri , Bipin Dama , Mark Webster
- Applicant: Kalpendu Shastri , Bipin Dama , Mark Webster
- Main IPC: H04B10/00
- IPC: H04B10/00

Abstract:
An optical interconnection arrangement for use in high data applications is presented that eliminates the need for extensive serialization/de-serialization (SERDES) functionality by utilizing pulse amplitude modulation (PAM) techniques to represent the data in the optical domain while utilizing a separate channel for transmitting an optical clock signal, eliminating the need for clock recovery circuitry on the receive end of the arrangement.
Public/Granted literature
- US20100316391A1 Optical Interconnection Arrangement For High Speed, High Density Communication Systems Public/Granted day:2010-12-16
Information query