发明授权
- 专利标题： Chamber inserts and apparatuses for processing a substrate
- 专利标题（中）： 腔体插入件和用于处理衬底的装置
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申请号： US11447933申请日： 2006-06-07
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公开(公告)号： US08366827B2公开(公告)日： 2013-02-05
- 发明人: Jung-Hun Seo , Jin-Gi Hong , Kyung-Bum Koo , Yun-Ho Choi , Eun-Taeck Lee , Hyun Chul Kwun
- 申请人： Jung-Hun Seo , Jin-Gi Hong , Kyung-Bum Koo , Yun-Ho Choi , Eun-Taeck Lee , Hyun Chul Kwun
- 申请人地址： KR Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2005-0056734 20050629
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; C23F1/00 ; H01L21/306
摘要：
Disclosed are chamber inserts and apparatuses using the chamber inserts. A chamber insert may include a cylindrical body portion including a top end portion and a bottom end portion, a first protruding portion extending outwardly from a first portion of the cylindrical body portion, the first portion positioned circumferentially along the cylindrical body portion and a second protruding portion extending outwardly from a second portion of the cylindrical body portion, the second portion positioned circumferentially along less than all of the cylindrical body portion. In another example, the chamber insert may include a cylindrical body portion including a top end portion and a bottom end portion, the cylindrical body portion including a slit and at least one hole, the slit and the at least one hole positioned circumferentially along the cylindrical body portion and a first protruding portion extending outwardly from a first portion of the cylindrical body portion.