发明授权
- 专利标题: Liquid-ejection head and method for manufacturing liquid-ejection head substrate
- 专利标题(中): 液体喷射头和液体喷射头基板的制造方法
-
申请号: US12204802申请日: 2008-09-05
-
公开(公告)号: US08366950B2公开(公告)日: 2013-02-05
- 发明人: Mitsuru Chida , Toshiyasu Sakai , Noriyasu Ozaki , Hiroyuki Abo , Kazuya Abe , Kenji Ono
- 申请人: Mitsuru Chida , Toshiyasu Sakai , Noriyasu Ozaki , Hiroyuki Abo , Kazuya Abe , Kenji Ono
- 申请人地址: JP Tokyo
- 专利权人: Canon Kabushiki Kaisha
- 当前专利权人: Canon Kabushiki Kaisha
- 当前专利权人地址: JP Tokyo
- 代理机构: Canon USA Inc IP Division
- 优先权: JP2007-231356 20070906
- 主分类号: G01D15/00
- IPC分类号: G01D15/00
摘要:
A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.